diff --git a/docs/developers/hardware_ref/architecture.md b/docs/developers/hardware_ref/architecture.md index f4a430f..5c8e02e 100644 --- a/docs/developers/hardware_ref/architecture.md +++ b/docs/developers/hardware_ref/architecture.md @@ -14,15 +14,15 @@ to the following electronic diagram, featuring 3 main blocks: - 1x 420 mAh 402540 LiPo battery, containing an active protection circuitry -![FunKey S Block Diagram](/assets/images/FunKey_S_Block_Diagram.png) +![FunKey S Block Diagram](/assets/images/FunKey_S_Block_Diagram.png){: .lightbox} ## 3D View A 3D rendering of the PCBA done in KiCAD produces the images below: -![FunKey Top](/assets/images/FunKey_S_Top.png) +![FunKey Top](/assets/images/FunKey_S_Top.png){: .lightbox} -![FunKey Bottom](/assets/images/FunKey_S_Bottom.png) +![FunKey Bottom](/assets/images/FunKey_S_Bottom.png){: .lightbox} ## BOM diff --git a/docs/developers/hardware_ref/audio.md b/docs/developers/hardware_ref/audio.md index 5daae44..48928e8 100644 --- a/docs/developers/hardware_ref/audio.md +++ b/docs/developers/hardware_ref/audio.md @@ -53,7 +53,7 @@ required to drive the speaker. Here is the corresponding schematic: -![Audio Schematics](/assets/images/Audio_Schematics.png) +![Audio Schematics](/assets/images/Audio_Schematics.png){: .lightbox} We chose the right headphone channel HPOUTR that is fed to the audio amplifier **U2** through a coupling capacitor **C3**. diff --git a/docs/developers/hardware_ref/buttons.md b/docs/developers/hardware_ref/buttons.md index f67a7a6..237777b 100644 --- a/docs/developers/hardware_ref/buttons.md +++ b/docs/developers/hardware_ref/buttons.md @@ -76,7 +76,7 @@ when required. Here is the corresponding main schematic for the buttons: -![Main Button Schematics](/assets/images/Main_Button_Schematics.png) +![Main Button Schematics](/assets/images/Main_Button_Schematics.png){: .lightbox} The main component is of course the I/O expander **U1**, with the control signals to the CPU/PMIC on the north side. @@ -107,7 +107,7 @@ user! The other buttons are wired in the same fashion: -![Secondary Button Schematics](/assets/images/Secondary_Button_Schematics.png) +![Secondary Button Schematics](/assets/images/Secondary_Button_Schematics.png){: .lightbox} The "U", "L", "D", "R", "A", "B", "X" and "Y" buttons **S3**, **S4**, **S5**, **S6**, **S8**, **S9**, **S10** and **S11** are of the same diff --git a/docs/developers/hardware_ref/cpu.md b/docs/developers/hardware_ref/cpu.md index aed1407..5e251c9 100644 --- a/docs/developers/hardware_ref/cpu.md +++ b/docs/developers/hardware_ref/cpu.md @@ -57,7 +57,7 @@ purpose. Here is the part of the schematics corresponding to the CPU core: -![CPU Schematics](/assets/images/CPU_Schematics.png) +![CPU Schematics](/assets/images/CPU_Schematics.png){: .lightbox} ## SoC Blocks @@ -190,13 +190,13 @@ termination resistors on the data lines DQx. DDR2 or DDR3 DRAMs feature merged drivers and dynamic on-chip termination like this ("VDDQ/2" is labeled "SVREF" in our schematic): -![DRAM Merged Drivers](/assets/images/DRAM_Merged_Drivers.png) +![DRAM Merged Drivers](/assets/images/DRAM_Merged_Drivers.png){: .lightbox} The V3s DDR2 DRAM has an active termination calibration circuitry and procedure called "_ZQ Calibration_" requiring an accurate 1% 240 Ω resistor **R11** connected internally like this: -![Pull-Up Calibration](/assets/images/Pull-Up_Calibration.png) +![Pull-Up Calibration](/assets/images/Pull-Up_Calibration.png){: .lightbox} More information on the DDR2 DRAM ZQ Calibration subject can be found in this [Micron Application Note][14]. diff --git a/docs/developers/hardware_ref/magnetic_switch.md b/docs/developers/hardware_ref/magnetic_switch.md index f8479d0..8b3f5eb 100644 --- a/docs/developers/hardware_ref/magnetic_switch.md +++ b/docs/developers/hardware_ref/magnetic_switch.md @@ -27,7 +27,7 @@ Meder MK24][1]. Here is the corresponding schematics, already covered in the PMIC discussion: -![Magnetic Sensor Schematics](/assets/images/Magnetic_Sensor_Schematics.png) +![Magnetic Sensor Schematics](/assets/images/Magnetic_Sensor_Schematics.png){: .lightbox} The global PMIC chip enable signal N_OE is activated by default through a 47kΩ resistor **R17** to GND, but the magnetic Reed switch diff --git a/docs/developers/hardware_ref/power/decoupling.md b/docs/developers/hardware_ref/power/decoupling.md index 55744df..d9615bb 100644 --- a/docs/developers/hardware_ref/power/decoupling.md +++ b/docs/developers/hardware_ref/power/decoupling.md @@ -97,7 +97,7 @@ are used for much lower currents and much briefer periods (typically The last part of the FunKey schematics merely contains only decoupling capacitors: -![Decoupling Schematics](/assets/images/Decoupling_Schematics.png) +![Decoupling Schematics](/assets/images/Decoupling_Schematics.png){: .lightbox} One exception is the Allwinner V3s CPU HPR/HPL circuit which features an RC-to-ground circuit between the amplifier and the preamplifier diff --git a/docs/developers/hardware_ref/power/dram.md b/docs/developers/hardware_ref/power/dram.md index 0733d83..0861179 100644 --- a/docs/developers/hardware_ref/power/dram.md +++ b/docs/developers/hardware_ref/power/dram.md @@ -19,7 +19,7 @@ Design][2]. Here is the corresponding DRAM Power schematics: -![DRAM Power Schematics](/assets/images/DRAM_Power_Schematics.png) +![DRAM Power Schematics](/assets/images/DRAM_Power_Schematics.png){: .lightbox} Nothing very fancy here: the SMPS chip **U4** has its required input filter capacitor **C37** and output capacitors **C65** and **C73**. diff --git a/docs/developers/hardware_ref/power/pmic.md b/docs/developers/hardware_ref/power/pmic.md index 90411e3..dbebf63 100644 --- a/docs/developers/hardware_ref/power/pmic.md +++ b/docs/developers/hardware_ref/power/pmic.md @@ -28,7 +28,7 @@ Their AXP20x products are highly-integrated PMICs that are optimized for applications requiring single-cell Li-battery (Li-Ion/Polymer), multiple output DC-DC converters and LDOs. Here is a block diagram: -![PMIC Block Diagram](/assets/images/AXP20x_Block_Diagram.png) +![PMIC Block Diagram](/assets/images/AXP20x_Block_Diagram.png){: .lightbox} The AXP20x features: @@ -88,7 +88,7 @@ schematics for using an AXP203 to supply the power to a V3s-based dashboard camera design. It follows closely the application diagram provided in the AXP20x datasheets: -![AXP20x Application Diagram](/assets/images/AXP20x_Application_Diagram.png) +![AXP20x Application Diagram](/assets/images/AXP20x_Application_Diagram.png){: .lightbox} More hints are provided in our self-translated [V3s Hardware Design Guide][10] (page 7) too. @@ -110,7 +110,7 @@ S** device only uses 2 out of the 5 integrated LDOs: Here are the PMIC schematics: -![PMIC Schematics](/assets/images/PMIC_Schematics.png) +![PMIC Schematics](/assets/images/PMIC_Schematics.png){: .lightbox} These schematics may look intimidating and complex, but they are in fact just a collection of simple basic elements, and it is actually diff --git a/docs/developers/hardware_ref/screen.md b/docs/developers/hardware_ref/screen.md index 920c6d4..9e523d3 100644 --- a/docs/developers/hardware_ref/screen.md +++ b/docs/developers/hardware_ref/screen.md @@ -82,7 +82,7 @@ a one-time tooling fee of ~ $800. The schematic is quite simple: -![SPI LCD Schematics](/assets/images/SPI_LCD_Schematics.png) +![SPI LCD Schematics](/assets/images/SPI_LCD_Schematics.png){: .lightbox} The main component is of course the Hirose screen connector **J3**, with the following signals: @@ -120,7 +120,7 @@ the screen, we need to drive these LEDs "from the high-side", i.e. between the +3V3 power supply and the LEDA pin, so a MOSFET-P transistor is necessary: -![Backlight Schematics](/assets/images/Backlight_Schematics.png) +![Backlight Schematics](/assets/images/Backlight_Schematics.png){: .lightbox} As we want the backlight to be on by default, we need to drive it to GND by default: this is the role of **R7**. The role of **R5** is then diff --git a/docs/developers/hardware_ref/sd-card.md b/docs/developers/hardware_ref/sd-card.md index 26448b3..cf10e8d 100644 --- a/docs/developers/hardware_ref/sd-card.md +++ b/docs/developers/hardware_ref/sd-card.md @@ -26,7 +26,7 @@ But a good summary of the requirements is given in the "[AN10911 SD(HC)-memory card and MMC Interface conditioning][3]" application note from NXP, from which this schematic is taken: -![SD/MMC Interface](/assets/images/SD_MMC_Interface.png) +![SD MMC Interface](/assets/images/SD_MMC_Interface.png){: .lightbox} !!! Warning This schematic does not include details concerning card-supply and @@ -80,7 +80,7 @@ an open-drain output mode, and its value should be undercut (down to The FunKey SD Card interface schematic is the following: -![SD Card Schematics](/assets/images/SD_Card_Schematics.png) +![SD Card Schematics](/assets/images/SD_Card_Schematics.png){: .lightbox} ![TF-110](/assets/images/TF-110.png){: align=left } diff --git a/docs/developers/hardware_ref/uart.md b/docs/developers/hardware_ref/uart.md index 863e81e..5c301cf 100644 --- a/docs/developers/hardware_ref/uart.md +++ b/docs/developers/hardware_ref/uart.md @@ -12,7 +12,7 @@ loging into the system over an UART. The Console schematic only requires a minimum of external components: -![Console Schematics](/assets/images/UART_Schematics.png) +![Console Schematics](/assets/images/UART_Schematics.png){: .lightbox} Besides the 3-pin 1.27 mm (0.05") pitch header J1 that will not be mounted on standard products, there is only a single series resistor diff --git a/docs/developers/hardware_ref/usb.md b/docs/developers/hardware_ref/usb.md index 257f41f..21a358c 100644 --- a/docs/developers/hardware_ref/usb.md +++ b/docs/developers/hardware_ref/usb.md @@ -22,7 +22,7 @@ user don't pull the chord straight. The USB schematic is the following: -![USB Schematics](/assets/images/USB_Schematics.png) +![USB Schematics](/assets/images/USB_Schematics.png){: .lightbox} Before connecting 2 devices using an USB cable, they may be at completely different absolute voltages, and during cable insertion,